BUNDLE SUPERMICRO UP SuperServer SYS-111C-NR

Virtualization, HPCCDN, Edge Nodes, Cloud Computing,
Data Center Optimized, Storage Headnode

https://www.supermicro.com/en/products/system/up/1u/sys-111c-nr

Specifikace

Bundle obsahuje
SYS-111C-NR	UP 1U X13SEDW-F, CSE-LB16TS-R860AW3
EWCSC	0% 3 YRS LABOR, 3 YRS PARTS, 1 YR CRS UNDER LIMITED WRNTY
P4X-EMR4509Y-SRN61-LCC	4509Y 2P 8C/2.6G/125W (8/1.9, 4/2.7/105) 22.5M SGX64 DSA 7yr SP5
2xx MEM-DR516MB-ER48	16GB DDR5-4800 1RX8 (16Gb) RDIMM
2x HDS-M2N4-480G0-E1-TXD-NON-080	SSD M.2 NVMe PCIe4 480GB 1DWPD TLC D, 80mm
SKT-1424L-001B-FXC	SOCKET E E1B CARRIER LGA 4677 W/SHIM SP MCC,LCC,DG1.0 ,RoHS
CBL-MCIO-1225M5Y	MCIO (x8 to 2 x4) STR,25CM,85OHM,RoHS
CBL-MCIO-1240AM5-X	MCIO (x8 to x8) STR,40CM,LNRV,85OHM,RoHS
MC0037	ASSEMBLY FEE
Specifikace serveru
Form Factor	1U Rackmount Enclosure: 437 x 43 x 597mm (17.2" x 1.7" x 23.5") Package: 605 x 197 x 822mm (23.8" x 7.8" x 32.4")
Processor	Single Socket E (LGA-4677) 5th Gen Intel Xeon / 4th Gen Intel Xeon Scalable processors Up to 64C/128T; Up to 320MB Cache
GPU	Max GPU Count: Up to 2 single-width GPU(s) Supported GPU: NVIDIA PCIe: T1000, L4, A2 CPU-GPU Interconnect: PCIe 5.0 x16 CPU-to-GPU Interconnect
System Memory	Slot Count: 16 DIMM slots/8 Channels Max Memory (1DPC): Up to 2TB 5600MT/s ECC DDR5 RDIMM Max Memory (2DPC): Up to 4TB 4400MT/s ECC DDR5 RDIMM
Drive Bays Configuration	Default: Total 10 bay(s) 10 front hot-swap 2.5" PCIe 5.0 NVMe*/SAS*/SATA drive bay(s) (*NVMe/SAS support may require additional storage controller and/or cables, please see the optional parts list for details) M.2: 2 M.2 PCIe 3.0 x2 NVMe slot(s) (M-key 2280/22110)
Expansion Slots	Default 2 PCIe 5.0 x16 FHHL slot(s) 2 PCIe 5.0 x16 AIOM slot(s) (OCP 3.0 compatible)
On-Board Devices	SATA: SATA (6Gbps) ; RAID 0/1/5/10 support NVMe: NVMe; RAID 0/1/5/10 support(Intel VROC RAID key required) Chipset: Intel C741 Network Connectivity: Via AIOM IPMI: Support for Intelligent Platform Management Interface v.2.0 IPMI 2.0 with virtual media over LAN and KVM-over-LAN support
Input / Output	LAN: 1 RJ45 1 GbE Dedicated BMC LAN port(s) USB: 2 USB 3.2 Gen1 Type-A port(s) (rear) 2 USB 2.0 Type-A port(s) (front) Video: 1 VGA port(s) Serial: 1 COM port(s) (Rear) TPM: 1 TPM header
System Cooling	Fans: 6 middle cooling PWM 40x40x56mm Fan(s)
Power Supply	2x 800W/860W Redundant (1 + 1) Titanium Level power supplies
System BIOS	BIOS Type: AMI 32MB SPI Flash EEPROM
Management	CPU: Monitors for CPU Cores, Chipset Voltages, Memory 8 Phase-switching voltage regulator FAN: Fans with tachometer monitoring Status monitor for speed control Pulse Width Modulated (PWM) fan connectors Temperature: Monitoring for CPU and chassis environment Thermal Control for fan connector
PC Health Monitoring	FAN: Fans with tachometer monitoring Status monitor for speed control Pulse Width Modulated (PWM) fan connectors Temperature: Monitoring for CPU and chassis environment Thermal Control for fan connectors Voltage: System temperature, Memory temperature, CPU temperature, 3.3V standby, +5V standby, +5V, +3.3V, +12V, CPU thermal trip support
Dimensions and Weight	Weight: Gross Weight: 40 lbs (18.1 kg) Net Weight: 25 lbs (11.3 kg) Available Color: Black front & silver body
Operating Environment	Operating Temperature: 10°C ~ 35°C (50°F ~ 95°F) Non-operating Temperature: -30°C to 60°C (-22°F to 140°F) Operating Relative Humidity: 8% to 80% (non-condensing) Non-operating Relative Humidity: 8% to 90% (non-condensing)
Motherboard	X13SEDW-F
Chassis	CSE-LB16TS-R0AWNP3